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0.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic

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0.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic

0.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic
0.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic 0.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic

Large Image :  0.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic

Product Details:
Place of Origin: China
Brand Name: Alloy 4J29
Certification: ISO 9001 and RoHS
Model Number: Kovar / 4J29
Payment & Shipping Terms:
Minimum Order Quantity: 10KG
Price: USD 30~50/ kg
Packaging Details: Waterproof paper, Carton and Wooden Case
Delivery Time: 4-8 weeks
Payment Terms: T/T, Western Union, L/C, Paypal
Supply Ability: 30000KG per month

0.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic

Description
Shape: Strip, Foil, Sheet, Wire Condition: Bright/ Oxidized; Soft/ Hard
Standard: YB/T5231-2005 / ГОСТ 14080-78 Color: Silver
Weight Of Coil: 1~45 KG
High Light:

4J29 Precision Strip

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Stamping IC Framework Precision Strip

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Shell Metal Ceramic Nickel Alloy Strip

4j29 Strip 0.15mm*20mm for Stamping Shell Metal Ceramic

 

(Common Name: Kovar, Nilo K, KV-1, Dilver Po, Vacon 12)
Alloy-4J29 also known as Kovar alloy. it was invented to meet the need for a reliable glass-to-metal seal, which is required in electronic devices such as light bulbs, vacuum tubes, cathode ray tubes, and in vacuum systems in chemistry and other scientific research. Most metals cannot seal to glass because their coefficient of thermal expansion is not the same as glass, so as the joint cools after fabrication the stresses due to the differential expansion rates of the glass and metal cause the joint to crack.
(-Kovar)
Kovar is a nickel-cobalt ferrous alloy compositionally identical to Fernico, designed to be compatible with the thermal expansion characteristics of borosilicate glass (~5 × 10?6 /K between 30 and 200 °C, to ~10 × 10?6 /K at 800 °C) in order to allow direct mechanical connections over a range of temperatures. It finds application in electroplated conductors entering glass envelopes of electronic parts such as vacuum tubes (valves), X-ray and microwave tubes and some lightbulbs.
The name Kovar is often used as a general term for Fe-Ni alloys with these particular thermal expansion properties. Note the related particular Fe-Ni alloy Invar which exhibits minimum thermal expansion.

Alloy-4J29was invented to meet the need for a reliable glass-to-metal seal, which is required in electronic devices such as light bulbs, vacuum tubes, cathode ray tubes, and in vacuum systems in chemistry and other scientific research. Most metals cannot seal to glass because their coefficient of thermal expansion is not the same as glass, so as the joint cools after fabrication the stresses due to the differential expansion rates of the glass and metal cause the joint to crack.

Alloy-4J29 not only has thermal expansion similar to glass, but its nonlinear thermal expansion curve can often be made to match a glass, thus allowing the joint to tolerate a wide temperature range. Chemically, it bonds to glass via the intermediate oxide layer of nickel oxide and cobalt oxide; the proportion of iron oxide is low due to its reduction with cobalt. The bond strength is highly dependent on the oxide layer thickness and character. The presence of cobalt makes the oxide layer easier to melt and dissolve in the molten glass. A grey, grey-blue or grey-brown color indicates a good seal. A metallic color indicates lack of oxide, while black color indicates overly oxidized metal, in both cases leading to a weak joint.

Mainly used in electric vacuum components and emission control, shock tube, igniting tube, glass magnetron, transistors, seal plug, relay, integrated circuits lead, chassis, brackets and other housing sealing.


Normal composition%


Ni
28.5~29.5 Fe Bal. Co 16.8~17.8 Si ≤0.3
Mo ≤0.2 Cu ≤0.2 Cr ≤0.2 Mn ≤0.5
C ≤0.03 P ≤0.02 S ≤0.02    



Tensile Strength, MPa


Code of condition
Condition Wire Strip
R Soft ≤585 ≤570
1/4I 1/4 Hard 585~725 520~630
1/2I 1/2 Hard 655~795 590~700
3/4I 3/4 Hard 725~860 600~770
I Hard ≥850 ≥700



Typical Physical properties


Density (g/cm3)
8.2
Electrical resistivity at 20ºC(mm2/m) 0.48
Temperature factor of resistivity(20ºC~100ºC)X10-5/ºC 3.7~3.9
Curie point Tc/ ºC 430
Elastic Modulus, E/ Gpa 138




Coefficient of expansion

θ/ºC α1/10-6ºC-1 θ/ºC α1/10-6ºC-1
20~60 7.8 20~500 6.2
20~100 6.4 20~550 7.1
20~200 5.9 20~600 7.8
20~300 5.3 20~700 9.2
20~400 5.1 20~800 10.2
20~450 5.3 20~900 11.4




Thermal conductivity

θ/ºC 100 200 300 400 500
λ/ W/(m*ºC) 20.6 21.5 22.7 23.7 25.4
The heat treatment process
Annealing for stress relief Heated to 470~540ºC and hold 1~2 h. Cold down
annealing In vacuum heated to 750~900ºC
Holding time 14 min~1h.
Cooling rate No more than 10 ºC/min cooled to 200 ºC

 

 

0.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic 00.15mm X 20mm 4J29 Precision Strip For Stamping IC Framework Shell Metal Ceramic 1

Contact Details
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Contact Person: Lisa

Tel: +8618017457857

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