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Shanghai Tankii Alloy Material Co.,Ltd
Shanghai Tankii Alloy Material Co.,Ltd
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Mobile Phone Battery Beryllium Copper Foil 0.05 X 20mm Cube2 Xhmb High Hardness

Product Details

Place of Origin: Shanghai,China.

Brand Name: TANKII

Certification: SGS, ISO

Model Number: C1720

Payment & Shipping Terms

Minimum Order Quantity: 50KG

Price: Negotiable

Packaging Details: Wooden case

Delivery Time: 7-12days

Payment Terms: L/C, T/T, Western Union

Supply Ability: 150Tons per month

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Specifications
Highlight:

copper and nickel alloy

,

alloy of copper and nickel

Material:
Beryllium Copper
Surface:
Bright
Shape:
Strip Coil Rod Bar
Width:
1-300mm
Thickness:
0.01mm Min
Material:
Beryllium Copper
Surface:
Bright
Shape:
Strip Coil Rod Bar
Width:
1-300mm
Thickness:
0.01mm Min
Description
Mobile Phone Battery Beryllium Copper Foil 0.05 X 20mm Cube2 Xhmb High Hardness

 

 

C17200 XHMB high hardness beryllium copper foil Strip 0.05x20mm

 

Beryllium copper C17200
Cube2--C17200 (CDA 172) Beryllium Copper is the most commonly utilized Copper Beryllium alloy and is notable for its highest strength and hardness compared to commercial copper alloys. C17200 alloy contains appr. 2% of beryllium and achieves its ultimate tensile strength can exceed 200 ksi, while the hardness approaches Rockwell C45. Meanwhile, the electrical conductivity is a minimum of 22% IACS in the fully aged condition.C17200 also exhibits exceptional resistance to stress relaxation at elevated temperatures.

 

Chemical Composition

ASTM Cu Ni Co Be
C17200 Balance Ni+Co≥0.2,Ni+Co+Fe≤0.6 1.80-2.10
C17000 Balance Ni+Co≥0.2,Ni+Co+Fe≤0.6 1.60-1.85
C17300 Balance Ni+Co≥0.2,Ni+Co+Fe≤0.6 1.85-2.10

 

ASTM Cu Ni Co Be
C17500 Balance - 2.4-2.7 0.4-0.7
C17510 Balance 1.4-2.2 0.3 0.2-0.6

 

Typical Physical Properties

Density (g/cm3) 8.36
Density before age hardening (g/cm3 8.25
Elastic Modulus (kg/mm2 (103)) 13.40
Thermal Expansion Coefficient (20 °C to 200 °C m/m/°C) 17 x 10-6
Thermal Conductivity (cal/(cm-s-°C)) 0.25
Melting Range (°C) 870-980


Mechanical property:(before heat treatment)

status Tensile strength
(N/mm2)
Hardness
(HV)
Conductivity
( IACS%)
Elongation
(%)
0 410-540 90-160 ≥17 35-70
1/4H 510-620 145-220 ≥16 10-35
1/2H 590-695 180-240 ≥15 5-25
H 685-835 210-270 ≥15 2-8


Mechanical property:(after heat treatment)

status Tensile strength
(N/mm2)
Hardness
(HV)
Conductivity
(IACS%)
Elongation
(%)
0T 1100-1380 325-400 22 3-11
1/4HT 1180-1400 350-430 ≥22 2-8
1/2HT 1240-1440 360-440 22 2-7
HT 1270-1480 380-450 22 1-5

 

Special Processing

State Tensile strength
(N/mm2)
Hardness
(HV)
Conductivity
(IACS%)
Elongation
(%)
OM 685-885 220-270 ≥17 ≥18
1/4HM 735-930 235-285 ≥17 ≥10
1/2HM 815-1010 260-310 ≥17 ≥8
HM 910-1110 295-345 ≥17 ≥6
XHM 1100-1290 340-390 ≥17 ≥2
XHMS 1210-1400 360-410 ≥17 ≥2

 


Features
1. High thermal conductivity
2. High corrosion resistance, especially suitable for polyoxyethylene (PVC) products mold.
3. High hardness, wear resistance and toughness, as inserts used with mould steel and aluminium can make the mold play a highly efficient, prolong the service life.
4. Polishing performance is good, can achieve high mirror surface precision and complicated shape design.
5. Good tackiness resistance, easy to welding with other metal, easy to machining, there is no need additional heat treatment.

Applications
Beryllium Copper is widely used in mold core, injection mold insert, mold cavity, corrosion resistant die, die casting
machine head, watering the crossing thimble, the punch mould parts, hot runner system such as accessories,
stretching die, casting mould, die-casting mould, and corrosion resistant wear resistant parts such as bearings,

Mobile Phone Battery Beryllium Copper Foil 0.05 X 20mm Cube2  Xhmb High Hardness 0

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