Product Details
Place of Origin: Shanghai, China
Brand Name: TANKII
Certification: ISO9001: 2008
Model Number: 6J40
Payment & Shipping Terms
Minimum Order Quantity: 20kg
Price: Negotiation
Packaging Details: Spool, carton, plywod case with plastic film as clients required
Delivery Time: 15-28DAYS
Payment Terms: L/C, T/T, Western Union, Paypal
Supply Ability: 300+TON+MONTH
Material: |
Constantan/ Manganin |
Wire Chemical: |
Cu Ni/ Cu Mn |
Type: |
Round Insulated Wire |
Insulation Material: |
Polyesterimide, Polyester |
Application: |
Electric Instrument, Electric Part Coil And So On |
Class: |
130,155,180,200,220 |
Material: |
Constantan/ Manganin |
Wire Chemical: |
Cu Ni/ Cu Mn |
Type: |
Round Insulated Wire |
Insulation Material: |
Polyesterimide, Polyester |
Application: |
Electric Instrument, Electric Part Coil And So On |
Class: |
130,155,180,200,220 |
CuNi 23 /nickel alloy 30/Cuprothal 30
Copper Nickel 23 or CuNi23Mn is a copper nickel alloy with the addition of Manganese to produce an alloy with a relatively low resistivity but high resistance to oxidation and chemical corrosion. Maximum working temperature is 500 °C. Applications include heating cords and mats
PropertiesGrade |
CuNi1 |
CuNi2 |
CuNi6 |
CuNi8 |
CuMn3 |
CuNi10 |
|
Main Chemical Composition |
Ni |
1 |
2 |
6 |
8 |
_ |
10 |
Mn |
_ |
_ |
_ |
_ |
3 |
_ |
|
Cu |
Bal |
Bal |
Bal |
Bal |
Bal |
Bal |
|
Max Continuous Service Temperature(oC) |
200 |
200 |
200 |
250 |
200 |
250 |
|
Resisivity at 20oC (Ωmm2/m) |
0.03 |
0.05 |
0.10 |
0.12 |
0.12 |
0.15 |
|
Density(g/cm3) |
8.9 |
8.9 |
8.9 |
8.9 |
8.8 |
8.9 |
|
Thermal Conductivity(α×10-6/oC) |
<100 |
<120 |
<60 |
<57 |
<38 |
<50 |
|
Tensile Strength(Mpa) |
≥210 |
≥220 |
≥250 |
≥270 |
≥290 |
≥290 |
|
EMF vs Cu(μV/oC)(0~100oC) |
-8 |
-12 |
-12 |
-22 |
_ |
-25 |
|
Approximate Melting Point( oC) |
1085 |
1090 |
1095 |
1097 |
1050 |
1100 |
|
Micrographic Structure |
austenite |
austenite |
austenite |
austenite |
austenite |
austenite |
|
Magnetic Property |
non |
non |
non |
non |
non |
non |
|
PropertiesGrade |
CuNi14 |
CuNi19 |
CuNi23 |
CuNi30 |
CuNi34 |
CuNi44 |
|
Main Chemical Composition |
Ni |
14 |
19 |
23 |
30 |
34 |
44 |
Mn |
0.3 |
0.5 |
0.5 |
1.0 |
1.0 |
1.0 |
|
Cu |
Bal |
Bal |
Bal |
Bal |
Bal |
Bal |
|
Max Continuous Service Temperature(oC) |
300 |
300 |
300 |
350 |
350 |
400 |
|
Resisivity at 20oC (Ωmm2/m) |
0.20 |
0.25 |
0.30 |
0.35 |
0.40 |
0.49 |
|
Density(g/cm3) |
8.9 |
8.9 |
8.9 |
8.9 |
8.9 |
8.9 |
|
Thermal Conductivity(α×10-6/oC) |
<30 |
<25 |
<16 |
<10 |
<0 |
<-6 |
|
Tensile Strength(Mpa) |
≥310 |
≥340 |
≥350 |
≥400 |
≥400 |
≥420 |
|
EMF vs Cu(μV/oC)(0~100oC) |
-28 |
-32 |
-34 |
-37 |
-39 |
-43 |
|
Approximate Melting Point( oC) |
1115 |
1135 |
1150 |
1170 |
1180 |
1280 |
|
Micrographic Structure |
austenite |
austenite |
austenite |
austenite |
austenite |
austenite |
|
Magnetic Property |
non |
non |
non |
non |
non |
non |