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Shanghai Tankii Alloy Material Co.,Ltd
Shanghai Tankii Alloy Material Co.,Ltd
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CuNi 23 Copper Nickel Alloy Wire

Product Details

Place of Origin: Shanghai, China

Brand Name: TANKII

Certification: ISO9001: 2008

Model Number: 6J40

Payment & Shipping Terms

Minimum Order Quantity: 20kg

Price: Negotiation

Packaging Details: Spool, carton, plywod case with plastic film as clients required

Delivery Time: 15-28DAYS

Payment Terms: L/C, T/T, Western Union, Paypal

Supply Ability: 300+TON+MONTH

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Specifications
Highlight:

CuNi 23 Copper Nickel Alloy Wire

,

Constantan Copper Nickel Alloy Wire

,

Polyesterimide Insulation Copper Nickel Wire

Material:
Constantan/ Manganin
Wire Chemical:
Cu Ni/ Cu Mn
Type:
Round Insulated Wire
Insulation Material:
Polyesterimide, Polyester
Application:
Electric Instrument, Electric Part Coil And So On
Class:
130,155,180,200,220
Material:
Constantan/ Manganin
Wire Chemical:
Cu Ni/ Cu Mn
Type:
Round Insulated Wire
Insulation Material:
Polyesterimide, Polyester
Application:
Electric Instrument, Electric Part Coil And So On
Class:
130,155,180,200,220
Description
CuNi 23 Copper Nickel Alloy Wire

CuNi 23 /nickel alloy 30/Cuprothal 30

Copper Nickel 23 or CuNi23Mn is a copper nickel alloy with the addition of Manganese to produce an alloy with a relatively low resistivity but high resistance to oxidation and chemical corrosion. Maximum working temperature is 500 °C. Applications include heating cords and mats

 

 

Related products

 

 

PropertiesGrade
 
CuNi1
 
CuNi2
 
CuNi6
 
CuNi8
 
CuMn3
 
CuNi10
 
Main Chemical Composition
 
Ni
 
1
 
2
 
6
 
8
 
_
 
10
 
Mn
 
_
 
_
 
_
 
_
 
3
 
_
 
Cu
 
Bal
 
Bal
 
Bal
 
Bal
 
Bal
 
Bal
 
Max Continuous Service Temperature(oC)
 
200
 
200
 
200
 
250
 
200
 
250
 
Resisivity at 20oC (Ωmm2/m)
 
0.03
 
0.05
 
0.10
 
0.12
 
0.12
 
0.15
 
Density(g/cm3)
 
8.9
 
8.9
 
8.9
 
8.9
 
8.8
 
8.9
 
Thermal Conductivity(α×10-6/oC)
 
<100
 
<120
 
<60
 
<57
 
<38
 
<50
 
Tensile Strength(Mpa)
 
≥210
 
≥220
 
≥250
 
≥270
 
≥290
 
≥290
 
EMF vs Cu(μV/oC)(0~100oC)
 
-8
 
-12
 
-12
 
-22
 
_
 
-25
 
Approximate Melting Point( oC)
 
1085
 
1090
 
1095
 
1097
 
1050
 
1100
 
Micrographic Structure
 
austenite
 
austenite
 
austenite
 
austenite
 
austenite
 
austenite
 
Magnetic Property
 
non
 
non
 
non
 
non
 
non
 
non
 

 
PropertiesGrade
 
CuNi14
 
CuNi19
 
CuNi23
 
CuNi30
 
CuNi34
 
CuNi44
 
Main Chemical Composition
 
Ni
 
14
 
19
 
23
 
30
 
34
 
44
 
Mn
 
0.3
 
0.5
 
0.5
 
1.0
 
1.0
 
1.0
 
Cu
 
Bal
 
Bal
 
Bal
 
Bal
 
Bal
 
Bal
 
Max Continuous Service Temperature(oC)
 
300
 
300
 
300
 
350
 
350
 
400
 
Resisivity at 20oC (Ωmm2/m)
 
0.20
 
0.25
 
0.30
 
0.35
 
0.40
 
0.49
 
Density(g/cm3)
 
8.9
 
8.9
 
8.9
 
8.9
 
8.9
 
8.9
 
Thermal Conductivity(α×10-6/oC)
 
<30
 
<25
 
<16
 
<10
 
<0
 
<-6
 
Tensile Strength(Mpa)
 
≥310
 
≥340
 
≥350
 
≥400
 
≥400
 
≥420
 
EMF vs Cu(μV/oC)(0~100oC)
 
-28
 
-32
 
-34
 
-37
 
-39
 
-43
 
Approximate Melting Point( oC)
 
1115
 
1135
 
1150
 
1170
 
1180
 
1280
 
Micrographic Structure
 
austenite
 
austenite
 
austenite
 
austenite
 
austenite
 
austenite
 
Magnetic Property
 
non
 
non
 
non
 
non
 
non
 
non
 

 

 

 

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