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Product Details:
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| Material: | Constantan/ Manganin | Wire Chemical: | Cu Ni/ Cu Mn |
|---|---|---|---|
| Type: | Round Insulated Wire | Insulation Material: | Polyesterimide, Polyester |
| Application: | Electric Instrument, Electric Part Coil And So On | Class: | 130,155,180,200,220 |
| Highlight: | CuNi 23 Copper Nickel Alloy Wire,Constantan Copper Nickel Alloy Wire,Polyesterimide Insulation Copper Nickel Wire |
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CuNi 23 /nickel alloy 30/Cuprothal 30
Copper Nickel 23 or CuNi23Mn is a copper nickel alloy with the addition of Manganese to produce an alloy with a relatively low resistivity but high resistance to oxidation and chemical corrosion. Maximum working temperature is 500 °C. Applications include heating cords and mats
| PropertiesGrade |
CuNi1 |
CuNi2 |
CuNi6 |
CuNi8 |
CuMn3 |
CuNi10 |
|
| Main Chemical Composition |
Ni |
1 |
2 |
6 |
8 |
_ |
10 |
| Mn |
_ |
_ |
_ |
_ |
3 |
_ |
|
| Cu |
Bal |
Bal |
Bal |
Bal |
Bal |
Bal |
|
| Max Continuous Service Temperature(oC) |
200 |
200 |
200 |
250 |
200 |
250 |
|
| Resisivity at 20oC (Ωmm2/m) |
0.03 |
0.05 |
0.10 |
0.12 |
0.12 |
0.15 |
|
| Density(g/cm3) |
8.9 |
8.9 |
8.9 |
8.9 |
8.8 |
8.9 |
|
| Thermal Conductivity(α×10-6/oC) |
<100 |
<120 |
<60 |
<57 |
<38 |
<50 |
|
| Tensile Strength(Mpa) |
≥210 |
≥220 |
≥250 |
≥270 |
≥290 |
≥290 |
|
| EMF vs Cu(μV/oC)(0~100oC) |
-8 |
-12 |
-12 |
-22 |
_ |
-25 |
|
| Approximate Melting Point( oC) |
1085 |
1090 |
1095 |
1097 |
1050 |
1100 |
|
| Micrographic Structure |
austenite |
austenite |
austenite |
austenite |
austenite |
austenite |
|
| Magnetic Property |
non |
non |
non |
non |
non |
non |
|
| PropertiesGrade |
CuNi14 |
CuNi19 |
CuNi23 |
CuNi30 |
CuNi34 |
CuNi44 |
|
| Main Chemical Composition |
Ni |
14 |
19 |
23 |
30 |
34 |
44 |
| Mn |
0.3 |
0.5 |
0.5 |
1.0 |
1.0 |
1.0 |
|
| Cu |
Bal |
Bal |
Bal |
Bal |
Bal |
Bal |
|
| Max Continuous Service Temperature(oC) |
300 |
300 |
300 |
350 |
350 |
400 |
|
| Resisivity at 20oC (Ωmm2/m) |
0.20 |
0.25 |
0.30 |
0.35 |
0.40 |
0.49 |
|
| Density(g/cm3) |
8.9 |
8.9 |
8.9 |
8.9 |
8.9 |
8.9 |
|
| Thermal Conductivity(α×10-6/oC) |
<30 |
<25 |
<16 |
<10 |
<0 |
<-6 |
|
| Tensile Strength(Mpa) |
≥310 |
≥340 |
≥350 |
≥400 |
≥400 |
≥420 |
|
| EMF vs Cu(μV/oC)(0~100oC) |
-28 |
-32 |
-34 |
-37 |
-39 |
-43 |
|
| Approximate Melting Point( oC) |
1115 |
1135 |
1150 |
1170 |
1180 |
1280 |
|
| Micrographic Structure |
austenite |
austenite |
austenite |
austenite |
austenite |
austenite |
|
| Magnetic Property |
non |
non |
non |
non |
non |
non |
|
Contact Person: Mr. Martin Lee
Tel: +86 150 0000 2421
Fax: 86-21-56116916
