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Product Details:
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| Application: | :Heating | Conductor Type: | : Solid, Round Wire |
|---|---|---|---|
| Surface Treatment: | : Hydrogen Annealing | Resistance: | : Stable |
| Resistance Tolerance: | :0.05 ±3% | Sample Free: | Available |
| High Light: | nickel copper alloy,alloy of copper and nickel |
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0.025Mm Copper Nickel Wire , CuNi2 Nickel Copper Wire for Electric Blanket
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Ni |
Mn |
Fe |
Si |
Cu |
Other |
ROHS Directive |
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|
Cd |
Pb |
Hg |
Cr |
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|
2 |
- |
- |
- |
Bal |
- |
ND |
ND |
ND |
ND |
Mechanical Properties
|
Max Continuous Service Temp |
200℃ |
|
Resisivity at 20℃ |
0.05±10%ohm mm2/m |
|
Density |
8.9 g/cm3 |
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Thermal Conductivity |
100(max) |
|
Melting Point |
1280℃ |
|
Tensile Strength,N/mm2 Annealed,Soft |
140~310 Mpa |
|
Tensile Strength,N/mm2 Cold Rolled |
280~620 Mpa |
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Elongation(anneal) |
25%(min) |
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Elongation(cold rolled) |
2%(min) |
|
EMF vs Cu, μV/ºC (0~100ºC) |
-8 |
|
Micrographic Structure |
austenite |
|
Magnetic Property |
Non |
CuNi2 Gradenames:
Alloy 30, CuNi2, 30 Alloy, HAl-30 Alloy 230, Cuprothal 30
Resistance Alloy 30-CuNi2 Size/Temper Capabilities
1, Condition: Bright, Annealed, Soft
2, Wire/Ribbon diameter 0.02mm-1.0mm packing in spool, big than 1.50mm packing in coil
3, Rod, Bar diameter 1mm-30mm
4, Strip: Thickness 0.01mm-7mm, Width 1mm-280mm
5, Enameled condition is available
Resistance Alloy Series
CuNi alloy wireis typically used in heating cables, fuses, resistors and various types of controllers.
As a big manufacturer and exporter in China on the line of electric resistance alloy, we can
supply all kinds of electric resistance alloy wire and strips (resistance steel wire and strips
weiding wire)
Chemical composition and main properties
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Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy |
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PropertiesGrade |
CuNi1 |
CuNi2 |
CuNi6 |
CuNi8 |
CuMn3 |
CuNi10 |
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Main Chemical Composition |
Ni |
1 |
2 |
6 |
8 |
_ |
10 |
|
|
Mn |
_ |
_ |
_ |
_ |
3 |
_ |
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|
Cu |
Bal |
Bal |
Bal |
Bal |
Bal |
Bal |
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Max Continuous Service Temperature(º C) |
200 |
200 |
200 |
250 |
200 |
250 |
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Resisivity at 2º C (Ω mm2/m) |
0.03 |
0.05 |
0.1 |
0.12 |
0.12 |
0.15 |
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Density(g/cm3) |
8.9 |
8.9 |
8.9 |
8.9 |
8.8 |
8.9 |
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Thermal Conductivity(α × 10-6º C) |
< 100 |
< 120 |
< 60 |
< 57 |
< 38 |
< 50 |
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Tensile Strength(Mpa) |
≥ 210 |
≥ 220 |
≥ 250 |
≥ 270 |
≥ 290 |
≥ 290 |
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EMF vs Cu(μ Vº C)(0~10º C) |
-8 |
-12 |
-12 |
-22 |
_ |
-25 |
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Approximate Melting Point(º C) |
1085 |
1090 |
1095 |
1097 |
1050 |
1100 |
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Micrographic Structure |
austenite |
austenite |
austenite |
austenite |
austenite |
austenite |
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Magnetic Property |
non |
non |
non |
non |
non |
non |
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|
|
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PropertiesGrade |
CuNi14 |
CuNi19 |
CuNi23 |
CuNi30 |
CuNi34 |
CuNi44 |
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Main Chemical Composition |
Ni |
14 |
19 |
23 |
30 |
34 |
44 |
|
|
Mn |
0.3 |
0.5 |
0.5 |
1 |
1 |
1 |
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|
Cu |
Bal |
Bal |
Bal |
Bal |
Bal |
Bal |
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|
Max Continuous Service Temperatureº C) |
300 |
300 |
300 |
350 |
350 |
400 |
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Resisivity at 2º C (Ω mm2/m) |
0.2 |
0.25 |
0.3 |
0.35 |
0.4 |
0.49 |
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|
Density(g/cm3) |
8.9 |
8.9 |
8.9 |
8.9 |
8.9 |
8.9 |
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|
Thermal Conductivity(α × 10-6º C) |
< 30 |
< 25 |
< 16 |
< 10 |
< 0 |
< -6 |
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Tensile Strength(Mpa) |
≥ 310 |
≥ 340 |
≥ 350 |
≥ 400 |
≥ 400 |
≥ 420 |
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EMF vs Cu(μ Vº C)(0~10º C) |
-28 |
-32 |
-34 |
-37 |
-39 |
-43 |
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Approximate Melting Point(º C) |
1115 |
1135 |
1150 |
1170 |
1180 |
1280 |
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Micrographic Structure |
austenite |
austenite |
austenite |
austenite |
austenite |
austenite |
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Magnetic Property |
non |
non |
non |
non |
non |
non |
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Contact Person: Mr. Martin Lee
Tel: +86 150 0000 2421
Fax: 86-21-56116916
