Product Details
Place of Origin: Shanghai,China
Brand Name: TANKII
Certification: ISO9001
Model Number: CuNi2
Payment & Shipping Terms
Minimum Order Quantity: 30kg
Price: Negotiation
Packaging Details: Spool, carton, plywod case with plastic film as clients required
Delivery Time: 7-20 DAYS
Payment Terms: L/C, T/T, Western Union, Paypal
Supply Ability: 100+TON+MONTH
Material: |
Copper Nickel |
Shape: |
Round Wire |
Density: |
8.9 |
Elongation: |
≥25% |
Melting Point: |
1090 Degree |
Material: |
Copper Nickel |
Shape: |
Round Wire |
Density: |
8.9 |
Elongation: |
≥25% |
Melting Point: |
1090 Degree |
Copper Nickel Alloy Wire CuNi2 Wire supplied by factory
The copper-based low resistance heating alloy is widely used in low-voltage circuit breaker, thermal overload relay, and other low-voltage electrical product. It is one of the key materials of the low-voltage electrical products. The materials produced by our company have the characteristics of good resistance consistency and superior stability. We can supply all kinds of round wire, flat and sheet materials.
CuNi2 low resistance heating alloy is widely used in low-voltage circuit breaker, thermal overload relay, and other low-voltage electrical product. It is one of the key materials of the low-voltage electrical products. The materials produced by our company have the characteristics of good resistance consistency and superior stability. We can supply all kinds of round wire, flat and sheet materials.
The alloy is non-magnetic. It is used for electrical regenerator's variable resistor and the strain resistor,
potentiometers, heating wires, heating cables and mats. Ribbons are used for heating of bimetals. Another field of application is manufacturing of thermocouples because it develops a high electromotive force (EMF) in association with others metals.
Copper nickel alloy series:Constantan CuNi40 (6J40), CuNi1, CuNi2, CuNi6, CuNi8, CuNi10, CuNi14, CuNi19, CuNi23,CuNi30, CuNi34, CuNi44.
Size dimension range:
Wire: 0.1-10mm
Ribbons: 0.05*0.2-2.0*6.0mm
Strip: 0.05*5.0-5.0*250mm
Main grades and properties
| Type | Electrical resistivity (20degreeΩ mm²/m) |
temperature coefficient of resistance (10^6/degree) |
Dens ity g/mm² |
Max. temperature (°c) |
Melting point (°c) |
| CuNi1 | 0.03 | <1000 | 8.9 | / | 1085 |
| CuNi2 | 0.05 | <1200 | 8.9 | 200 |
1090 |
| CuNi6 | 0.10 | <600 | 8.9 | 220 | 1095 |
| CuNi8 | 0.12 | <570 | 8.9 | 250 | 1097 |
| CuNi10 | 0.15 | <500 | 8.9 | 250 | 1100 |
| CuNi14 | 0.20 | <380 | 8.9 | 300 | 1115 |
| CuNi19 | 0.25 | <250 | 8.9 | 300 | 1135 |
| CuNi23 | 0.30 | <160 | 8.9 | 300 | 1150 |
| CuNi30 | 0.35 | <100 | 8.9 | 350 | 1170 |
| CuNi34 | 0.40 | -0 | 8.9 | 350 | 1180 |
| CuNi40 | 0.48 | ±40 | 8.9 | 400 | 1280 |
| CuNi44 | 0.49 | <-6 | 8.9 | 400 | 1280 |
CuNi2 Gradenames:
Alloy 30, CuNi2, 30 Alloy, HAl-30 Alloy 230, Cuprothal 30
Chemical composition and main properties
| Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy | ||||||||
| PropertiesGrade | CuNi1 | CuNi2 | CuNi6 | CuNi8 | CuMn3 | CuNi10 | ||
| Main Chemical Composition | Ni | 1 | 2 | 6 | 8 | _ | 10 | |
| Mn | _ | _ | _ | _ | 3 | _ | ||
| Cu | Bal | Bal | Bal | Bal | Bal | Bal | ||
| Max Continuous Service Temperature(º C) | 200 | 200 | 200 | 250 | 200 | 250 | ||
| Resisivity at 2º C (Ω mm2/m) | 0.03 | 0.05 | 0.1 | 0.12 | 0.12 | 0.15 | ||
| Density(g/cm3) | 8.9 | 8.9 | 8.9 | 8.9 | 8.8 | 8.9 | ||
| Thermal Conductivity(α × 10-6º C) | < 100 | < 120 | < 60 | < 57 | < 38 | < 50 | ||
| Tensile Strength(Mpa) | ≥ 210 | ≥ 220 | ≥ 250 | ≥ 270 | ≥ 290 | ≥ 290 | ||
| EMF vs Cu(μ Vº C)(0~10º C) | -8 | -12 | -12 | -22 | _ | -25 | ||
| Approximate Melting Point(º C) | 1085 | 1090 | 1095 | 1097 | 1050 | 1100 | ||
| Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | ||
| Magnetic Property | non | non | non | non | non | non | ||
| PropertiesGrade | CuNi14 | CuNi19 | CuNi23 | CuNi30 | CuNi34 | CuNi44 | ||
| Main Chemical Composition | Ni | 14 | 19 | 23 | 30 | 34 | 44 | |
| Mn | 0.3 | 0.5 | 0.5 | 1 | 1 | 1 | ||
| Cu | Bal | Bal | Bal | Bal | Bal | Bal | ||
| Max Continuous Service Temperatureº C) | 300 | 300 | 300 | 350 | 350 | 400 | ||
| Resisivity at 2º C (Ω mm2/m) | 0.2 | 0.25 | 0.3 | 0.35 | 0.4 | 0.49 | ||
| Density(g/cm3) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | ||
| Thermal Conductivity(α × 10-6º C) | < 30 | < 25 | < 16 | < 10 | < 0 | < -6 | ||
| Tensile Strength(Mpa) | ≥ 310 | ≥ 340 | ≥ 350 | ≥ 400 | ≥ 400 | ≥ 420 | ||
| EMF vs Cu(μ Vº C)(0~10º C) | -28 | -32 | -34 | -37 | -39 | -43 | ||
| Approximate Melting Point(º C) | 1115 | 1135 | 1150 | 1170 | 1180 | 1280 | ||
| Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | ||
| Magnetic Property | non | non | non | non | non |
non |
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